專任教師

陳文照 Wen-Jauh Chen

名譽教授
學歷 
清華大學材料科學工程研究所博士
研究領域 
材料微結構分析、奈米材料科技、穿透式電子顯微鏡
(05) 534-2601 分機
  • 學術期刊論文
  • 研討會論文
  • 技術報告
  • 專書及專書論文
  • 其他論著
  1. Wen Jauh Chen and Ting Yu Lai, 2022, Effectiveness of tungsten addition on the performance of electroplated nickel diffusion barriers for copper metallization on textured silicon, Thin Solid Films, Vol.746, Article 139122. (SCI)
  2. Ping-Hang Chen, Wen-Jauh Chen, Jiun-Yi Tseng, 2021, Thermal Stability of the Copper and the AZO Layer on Textured Silicon, Coatings, Vol.11, No.12, pp.1546. (SCIE)
  3. Jiun Yi Tseng, Wen Jauh Chen, and Kuan Chen Wu, 2021, Failure Behavior of Electroplated Co60Ru40 layer on NiSix/Si Substrate for Copper Metallization, International Journal of ELECTROCHEMICAL SCIENCE, Vol.16, pp.211132. (SCIE)
  4. Fangzhou SONG, Harunobu ONISHI, Wen-Jauh CHEN, Takeshi YABUTSUKA, Takeshi YAO, Shigeomi TAKAI, 2021, TEM Observation of LaPO4-Dispersed LATP Lithium-Ion Conductor, Electrochemistry, Vol.89, No.5, pp.480-483. (SCI)
  5. Yun-Wen Liao, Satoshi Kawabata, Takeshi Yabutsuka, Wen-Jauh Chen, Hideyuki Okumura, Shigeomi Takai, 2020, Low temperature phase transition phenomena in Ba- and Pb-substituted La2Mo2O9 oxide ion conductors, Solid State Ionics, Vol.354, p.115405. (SCI, SCIE)
  6. Shu Huei Hsieh, Wen Jauh Chen, Keisuke Ohdaira, 2020, Barrier performance of ITO flm on textured Si substrate, Journal of Materials Science: Materials in Electronics, Vol.31, No.16, pp.13808–13816. (SCI, SCIE)
  7. Kuan Chen Wu, Jiun Yi Tseng, Wen Jauh Chen, 2020, Electroplated Ru and RuCo films as a copper diffusion barrier, Applied Surface Science, Vol.516, p.146139. (SCI, SCIE)
  8. Hsin Hsan Wu and Wen Jauh Chen, 2020, Failure Behavior of Nickel Silicide Diffusion Barrier between Electroplating Cu and Textured Si Substrate, International Journal of ELECTROCHEMICAL SCIENCE, Vol.15, pp.5277-5286. (SCIE)
  9. Hsin Hsan Wu and Wen Jauh Chen, 2020, Failure Behavior of Nickel Silicide Diffusion Barrier between Electroplating Cu and Textured Si Substrate, International Journal of ELECTROCHEMICAL SCIENCE, Vol.15, pp.5277-5286. (SCIE)
  10. P. C. Tsai1*, J. H. Chen, W. J. Chen, C. L. Chang,, 2009, Synthesis and characterization of Ti-Si-C-N films by cathodic arc plasma deposition, The 10th International Symposium on Sputtering & Plasma Process, 2009/07/08-10, International Symposium on Sputtering & Plasma Process, Kanazawa.
  11. S.H. Hsieh, W.J. Chen*, T.H. Yeh, 2015, Degradation of methylene blue using ZnSe-graphene nanocomposites under visible-light irradiation, Ceramics International, Vol.41, pp.13759-13766. (SCI)
  12. S.H. Hsieh, W.J. Chen*, T.H. Yeh, 2015, Effect of various amounts of graphene oxide on the degradation characteristics of the ZnSe/graphene nanocomposites, Applied Surface Science, Vol.358, pp.63-69. (SCI)
  13. T. Wu, W. Chen* and W. Chen, 2009, Study of Al/DyFeCo/Al multilayers using scanning transmission electromicrope, 2009 IEEE International Magnetics Conference, 2009/05/04-08, International Magnetics Conference, California.
  14. S.H. Hsieh, W.J. Chen*, C.T. Wu, 2015, Pt-TiO2/graphene photocatalysts for degradation of AO7 dye under visible light, Applied Surface Science, Vol.340, pp.9-17. (SCI)
  15. 陳文照, 2012, Synthesis of ZnO:Al Transparent Conductive Thin Films Using Sol-gel Method, Procedia Engineering, Vol.36, pp.54–61. (EI)
  16. 陳文照, 2012, Hydrous ruthenium dioxide/multi-walled carbon-nanotube/titanium electrodes for supercapacitors, CARBON, Vol.50, pp.1740–1747. (SCI)
  17. C.M. Lee, L.X. Ye, J.M. Lee, T.H. Hsieh, J.W. Syu, W.J. Chen, C.Y. Huang, T.H. Wu, 2009, Magnetic properties of ultrathin TbFeCo magnetic films with perpendicular magnetic anisotropy, IEEE Transactions on Magnetics, Vol.45, pp.4023-4026. (SCI)
  18. Y.C. Lee, C.W. Lin, W.H. Lu, W.J. Chen, W.H. Lee, 2009, Influence of SiO2 Addition on the Dielectric Properties and Microstructure of (Ba0.96Ca0.04)(Ti0.85Zr0.15)O3 Ceramics, International Journal of Applied Ceramic Technology, Vol.6, No.6, pp.692-701. (SCI)
  19. W.L. Liu, S.H. Hsieh, C.H. Chen*, W.J. Chen, 2009, Effect of Fe metal on the growth of silicon oxide nanowires, International Journal of Minerals, Metallurgy and Materials, Vol.16, No.3, pp.317-321. (SCI)
  20. P.C. Tsai, W.J. Chen, J.H. Chen., C.L. Chang,, 2009, Deposition and characterization of TiBCN films by cathodic arc plasma evaporation, Thin Solid Films, Vol.5, pp.5044–5049. (SCI)
  21. S.H. Hsieh, C.M. Chien, W.L. Liu, W.J. Chen*, 2009, Failure behavior of ITO diffusion barrier between electroplating Cu and Si substrate annealed in a low vacuum, Applied Surface Science, Vol.255, No.6, pp.7357-7360. (SCI)
  22. W.L. Liu, S.H. Hsieh, W.J. Chen*, 2009, Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath, International Journal of Minerals, Metallurgy and Materials, Vol.16, No.2, pp.197-202. (SCI)
  23. C.C. Chuang, W.L. Liu, W.J. Chen*, J.H. Huang,, 2009, Growth of graphite film over the tops of vertical carbon nanotubes using Ni/Ti/Si substrate, International Journal of Minerals, Metallurgy and Materials, Vol.16, No.1, pp.128-134. (SCI)
  24. W.L. Liu, S.H. Hsieh, W.J. Chen, P.I. Wei, J.H. Lee,, 2009, Synthesis of the CuInSe2 thin film for solar cells using the electrodeposition technique and Taguchi method, International Journal of Minerals, Metallurgy and Materials, Vol.16, No.1, pp.101-107. (SCI)
  25. W.L. Liu, S.H. Hsieh, W.J. Chen*, Y.C. Hsu,, 2009, Growth behavior of electroless Ni-Co-P deposits on Fe, Applied Surface Science, Vol.255, pp.3880-3883. (SCI)
  26. C.H. Cheng, S.H. Lin, K.Y. Jhou, W.J. Chen, C.P. Chou, F.S. Yeh, J. Hu, M. Hwang, T. Arikado, S.P. McAlister, and A. Chin,, 2008, High Density and Low Leakage Current in TiO2 MIM Capacitors Processed at 300 C, IEEE ELECTRON DEVICE LETTERS, Vol.29, No.8, pp.845-847. (SCI)
  27. P. C. Tsai, Y. F. Hwang, J. Y. Chiang, and W. J. Chen, 2008, The effects of deposition parameters on the structure and properties of titanium-containing DLC films synthesized by cathodic arc plasma evaporation, Surface and Coatings Technology, Vol.202, No.22-23, pp.5350-5355. (SCI)
  28. C. C. Chuang, W. L. Liu, W. J. Chen*, J. H. Huang, 2008, Temperature and substrate dependence of structure and growth mechanism of carbon nanofiber, Applied Surface Science, Vol.254, pp.4681-4687. (SCI)
  29. W. L. Liu, S. H. Hsieh, and W. J. Chen*, 2008, Growth behavior of Ni-P film on Fe/Si substrate in an acid electroless plating bath, Journal of the Electrochemical Society, Vol.155, pp D192-D195. (SCI)
  30. C. C. Chuang, W. L. Liu, W. J. Chen*, J. H. Huang, 2008, The role of Ti interlayer in carbon nanotube growth, Surface and Coatings Technology, Vol.202, pp.2121-2125. (SCI)
  31. W.L. Liu, S.H. Hsieh, S.J. Hwang, T.K. Tsai, W. J. Chen, 2007, Tribological properties of electroless Ni-P-SiC composite coatings in rolling/sliding contact under boundary lubrication, Journal of University of Science and Technology Beijing, Vol.14, pp.167-172. (SCI)
  32. T.K. Tsai, S.S. Wu, W.L. Liu, S.H. Hsieh, and W. J. Chen, 2007, Electroless CoWP as a Diffusion Barrier between Electroless Copper and Silicon, J. Electron. Mater., Vol.36, pp.1408-1414. (SCI)
  33. H. J. Yang, A. Chin, W. J. Chen, C. F. Cheng, W. L. Huang, I. J. Hsieh, and S. P. McAlister, 2007, A Program-Erasable High-k Hf0.3N0.2O0.5 MIS Capacitor With Good Retention, IEEE Electron Device Lett., Vol.28, pp.913-915. (SCI)
  34. W. L. Liu, S. H. Hsieh, and W. J. Chen*, C. F. Lu, 2007, Growth of nanosized Zinc Oxide on Ni/Cu-Zn/SiO2/Si substrate, Surface and Coatings Technology, Vol.201, pp.9221-9225. (SCI)
  35. W. L. Liu, S. H. Hsieh, and W. J. Chen*, J. H. Lee, 2007, Study of nanosized Zinc Oxide on Cu-Zn alloy substrate using Taguchi method, Surface and Coatings Technology, Vol.201, pp.9238-9242. (SCI)
  36. K. C. Chiang, J. W. Lin, H. C. Pan, C. N. Hsiao, W. J. Chen, H. L. Kao, I. J. Hsieh, and Albert Chin, 2007, Very high density (44 fFμ m2) SrTiO3 MIM capacitors for RF applications, Journal of the Electrochemical Society, Vol.154, pp.H214-H216. (SCI)
  37. S.S. Wu, W.L. Liu, T.K. Tsai, S.H. Hsieh, and W.J. Chen, 2007, Growth behavior of electroless copper on silicon substrate, Journal of University of Science and Technology Beijing, Vol.14, pp.67-71. (SCI)
  38. W. J. Chen, W. L. Liu, S. H. Hsieh, 2007, Preparation of nanosized ZnO using alpha brass, Applied Surface Science, Vol.253, pp.6749-6753. (SCI)
  39. W. L. Liu, S. H. Hsieh, and W. J. Chen*, 2007, Preparation of Sn films deposited on carbon nanotubes, Applied Surface Science, Vol.253, pp.8356-8359. (SCI)
  40. W. L. Liu, S. H. Hsieh, T. K. Tsai, and W. J. Chen, 2007, Deposition of electroless Ni on micro-sized acrylic spheres, Journal of Materials Science, Vol.42, pp.2121–2125. (SCI)
  41. W.L. Liu, W. J. Chen*, T.K. Tsai, S.H. Hsieh and S.Y. Chang, 2007, Effect of nickel on the initial growth behavior of electroless Ni–Co–P alloy on silicon substrate, Applied Surface Science, Vol.253, pp.3843–3848. (SCI)
  42. W. L. Liu, W. J. Chen*, T. K. Tsai, S. H. Hsieh, C.M. Liu, 2007, Effect of Tin-doped Indium Oxide Film as Capping Layer on the Agglomeration of Copper Film and the Appearance of Copper Silicide, Applied Surface Science, Vol.253, pp.5516-5520. (SCI)
  43. W.L. Liu, W. J. Chen*, T.K. Tsai, H.H. Tsai, and S.H. Hsieh, 2006, Interface structure between epitaxial NiSi2 and Si, Journal of University of Science and Technology Beijing, Vol.13, pp.558-563. (SCI)
  44. W. L. Liu, W. J. Chen*, T. K. Tsai, S. H. Hsieh, C.M. Liu, 2006, Effect of Tin-doped Indium Oxide Film Thickness on the Diffusion Barrier between Silicon and Copper, Thin Solid Films,, Vol.515, pp.2387–2392. (SCI)
  45. C. C. Huang, K. C. Chiang, H. L. Kao, A. Chin, and W. J. Chen, 2006, RFIC TaN/SrTiO3/TaN MIM Capacitorswith 35 fF/m2 Capacitance Density,” IEEE Microwave and Wireless Components Letters, Vol.16, pp.493-495. (SCI)
  46. K. C. Chiang, C. C. Huang, G. L. Chen, W. J. Chen, H. L. Kao, Y. H. Wu, A. Chin, and S. P. McAlister, 2006, High-Performance SrTiO3 MIM Capacitors for Analog Applications, IEEE Transactions on Electron Devices, Vol.53, pp.2312-2319. (SCI)
  47. W. L. Liu, S. H. Hsieh, T. K. Tsai, W. J. Chen, 2006, Temperature and pH dependence of the electroless Ni-P deposition on silicon, Thin Solid Films, Vol.510, pp.102-106. (SCI)
  1. 陳文照, 2016, Electrical and Structural Properties of Bi-Substituted La2Mo2O9 Annealed at Intermediate Temperature, PRiME Meeting, 2016/10/02-07, The Electrochemical Society, Honolulu, Hawaii.
  2. Shu Huei Hsieh, Lilun Chang, Wenjauh Chen, 2015, Pt-MoSx/Graphene Nanocomposite for the Hydrogen Evolution Reaction, Advances in Engineering Research, 2015/11/27-28, Hong Kong Industrial Technology Research Centre, 廣州, pp.1256-1259.
  3. 陳文照 謝中敏 莊佳智 王建竣, 2015, 電鍍無電鍍鎳銅製成應用於矽太陽能電池之研究, 104年材料年會論文集, 2015/11/20-21, 中國材料科學學會, 高雄市, 中鋼公司.
  4. S. H. Hsieh, S. T. Ho, and W. J. Chen*, 2015, Silicon nanowires with MoSx and Pt as electrocatalysts for hydrogen evolution reaction, ACT 2015 International Thin Films Conference, 2015/11/15-18, Taiwan Association for Coatings and Thin Films Technology, 台南市,成功大學
  5. 陳文照, 2012, Effects of electrodeposition variables on properties of ZnO films, The 6th International Conference on Technological Advances of Thin Films & Surface Coatings, 2012/07/14-17, Thin Films Society, 新加坡.
  6. 陳文照, 2012, Study on Pt nanoparticles/graphene for fuel cell, The 6th International Conference on Technological Advances of Thin Films & Surface Coatings, 2012/07/14-17, Thin Films Society, 新加坡.
  7. 陳文照, 2012, Growth behavior of electroless nickel alloy deposition observed by transmission electron microscopy, International Conference on Advanced Materials Processing, 2012/06/24-27, 臺灣大學, 臺北.
  8. 陳文照, 2012, Effect of furnance atmosphere on the growth of Titania, International Conference on Advanced Materials Processing, 2012/06/24-27, 臺灣大學, 臺北.
  9. W. L. Liu, C. M. C. Chien, S. H. Hsieh, W. J. Chen*, 2009, Failure behavior of ITO diffusion barrier between electroplated Cu and Si substrate annealed in an atmosphere of Ar+H2 (5 vol%), The 10th International Symposium on Sputtering & Plasma Process, 2009/07/08-10, International Symposium on Sputtering & Plasma Process, Kanazawa.
  10. 陳文照, 2012, Effects of electrodeposition variables on properties of ZnO films, The 6th International Conference on Technological Advances of Thin Films & Surface Coatings, 2012/07/14-17, Thin Films Society, 新加坡.
  11. L. Liu, S. H. Hsieh, W. J. Chen*, 2009, Preparation of nanosized titania on Ni/Ti substrate by thermal chemical vapor deposition method, The 10th International Symposium on Sputtering & Plasma Process, 2009/07/08-10, International Symposium on Sputtering & Plasma Process, Kanazawa.
  12. P. C. Tsai, H. Y. Jeng, J. W. Lee, W. J. Chen, 2009, Characterization of aluminum-containing diamond like carbon films synthesized by cathodic arc plasma evaporation, The 10th International Symposium on Sputtering & Plasma Process, 2009/07/08-10, International Symposium on Sputtering & Plasma Process, Kanazawa.
  13. T. Wu, W. Chen* and W. Chen, 2009, Study of Al/DyFeCo/Al multilayers using scanning transmission electromicrope, 2009 IEEE International Magnetics Conference, 2009/05/04-08, International Magnetics Conference, California.
  14. C. Lee , L.Ye, J. Lee, J. Syu1, W. Chen and T. Wu,, 2009, Magnetic properties of ultrathin TbFeCo Magnetic Films with Perpendicular Magnetic Anisotropy, 2009 IEEE International Magnetics Conference, 2009/05/04-08, International Magnetics Conference, California.